Advanced Semiconductor Engineering, Inc, the semiconductor assembly and test service provider, showcased System in Package (SiP) solutions in consumer applications at Computex 2015. “It is our first time to attend Computex because we got a lot of customers' inquiries about the needs of multiple semiconductor chips and passive components to be integrated within a smaller and more compact module,” said CP Hung Ph.D., Corporate R&D Center Vice President of ASE. Compact and small will be a future trend for the market of smartphones, wearables, homes, connectivity and sensor applications. “That’s why we want to introduce SiP solutions through this opportunity, although we have already worked on the technique for over 10 years.”
SiP technology enables multiple components to be integrated within a smaller and more compact module without compromising the functionality and performance of the entire package or module. Therefore, SiP can be applied to numerous IC functions within very tight space constraints such as RF, processor, memory, sensors, power management, multimedia, and more. With Sip technology, every new module can be minimized the size from 20% to 30%.
On the other hand, SiP reduces the number of required manufacturing steps. Previously, each device function was developed onto individual IC chips, but SiP technology enable the ICs can be designed and directly embedded onto a substrate, then onto a module. The reduction in manufacturing steps results in less required materials as well as increased efficiency in logistics management during inventory shipment. “SiP will help a lot to shorten our customers’ assembling and testing period. The technology will help them to push their products forward on the market sooner than before,” commented Hung.
SiP solutions are implemented into a variety of applications, including smart living, connectivity, data management and diagnostic devices in healthcare. ASE predicts that there will be 2 new orders of SiP assembling or testing in 3Q or 4Q this year. One of the orders would be new generation of smart wearable device. The real contribution will be in the end of 2015.